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H1D3M2 OEM Unlock IC Chip For Google Pixel 8 & Pixel 9 series

Original price was: ₵1,150.00.Current price is: ₵850.00.

Get 100% control over restricted devices with the H1D3M2 OEM Unlock IC Chip. Engineered specifically for professional GSM repair technicians, this specialized micro-soldering component allows you to bypass carrier restrictions, force bootloader unlocking, remove factory reset protection (FRP), and wipe MDM profiles directly at the hardware level. It features a precise BGA footprint tailored for stable installation and seamless communication with the device’s logic board during the patch cycle.

Key Benefits & Functions

- Carrier & OEM Unlock: Safely forces the “OEM Unlocking” option to become active on greyed-out or network-restricted logic boards.
- MDM & FRP Removal: Permanently clears Mobile Device Management profiles and locks without risking standard software relocks.
- Temporary or Permanent Mod: Can be used as a temporary diagnostic bridge to flash custom firmware or left on-board depending on your repair workflow.

Hardware Compatibility

- Google Pixel 8 Series: Pixel 8, Pixel 8a, Pixel 8 Pro
- Google Pixel 9 Series: Pixel 9, Pixel 9 Pro, Pixel 9 Pro XL, Pixel 9 Pro Fold

Technical Specifications

- Chip Model: H1D3M2 (Upgraded Titan M2 Interface Revision)
- Package Type: BGA (Micro-soldering required)
- Condition: 100% Brand New, High-Grade Solder Ball Arrays
- Target Audience: Professional Repair Shops & Micro-soldering Technicians only